Yuan Li’s team reviewed the versatile role of eutectic gallium–indium (EGaIn) as a non-invasive, soft top electrode in fabricating and integrating self-assembled monolayer (SAM)-based molecular devices. By engineering EGaIn into various formats—conical tips, microfluidics, printing, and stamping—they achieved reliable, scalable, and flexible molecular junctions. These EGaIn-based platforms enabled stable charge transport measurements, high-throughput device fabrication, and integration into molecular diodes, memories, and synapses. The work highlights how liquid metal engineering transforms molecular electronics, facilitating high-density, flexible circuits and advancing the frontier of functional nanoscale device applications.